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Integrated circuits. --- Metal oxide semiconductors, Complementary. --- Application-specific integrated circuits. --- Circuits intégrés --- MOS complémentaires --- Circuits intégrés à la demande --- Circuits intégrés --- MOS complémentaires --- Circuits intégrés à la demande --- Application specific integrated circuits --- Metal oxide semiconductors, Complementary --- CMOS (Electronics) --- Complementary metal oxide semiconductors --- Semiconductors, Complementary metal oxide --- Digital electronics --- Logic circuits --- Transistor-transistor logic circuits --- ASICs (Integrated circuits) --- Integrated circuits

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Metal oxide semiconductors, Complementary --- Integrated circuits --- Silicon-on-insulator technology --- Very large scale integration --- Metal oxide semiconductors, Complementary. --- Silicon-on-insulator technology. --- Very large scale integration. --- SOI devices --- CMOS (Electronics) --- Complementary metal oxide semiconductors --- Semiconductors, Complementary metal oxide --- Very large scale integration of circuits --- VLSI circuits --- Electric insulators and insulation --- Semiconductors --- Digital electronics --- Logic circuits --- Transistor-transistor logic circuits --- Integrated circuits - Very large scale integration

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The recent boom in the mobile telecommunication market has trapped the interest of almost all electronic and communication companies worldwide. New applications arise every day, more and more countries are covered by digital cellular systems and the competition between the several providers has caused prices to drop rapidly. The creation of this essentially new market would not have been possible without the ap­ pearance of smalI, low-power, high-performant and certainly low-cost mobile termi­ nals. The evolution in microelectronics has played a dominant role in this by creating digital signal processing (DSP) chips with more and more computing power and com­ bining the discrete components of the RF front-end on a few ICs. This work is situated in this last area, i. e. the study of the full integration of the RF transceiver on a single die. Furthermore, in order to be compatible with the digital processing technology, a standard CMOS process without tuning, trimming or post-processing steps must be used. This should flatten the road towards the ultimate goal: the single chip mobile phone. The local oscillator (LO) frequency synthesizer poses some major problems for integration and is the subject of this work. The first, and also the largest, part of this text discusses the design of the Voltage­ Controlled Oscillator (VCO). The general phase noise theory of LC-oscillators is pre­ sented, and the concept of effective resistance and capacitance is introduced to char­ acterize and compare the performance of different LC-tanks.

Frequency synthesizers --- Wireless communication systems --- Metal oxide semiconductors, Complementary --- Design and construction --- Equipment and supplies --- -Metal oxide semiconductors, Complementary --- -Wireless communication systems --- -Academic collection --- Communication systems, Wireless --- Wireless data communication systems --- Wireless information networks --- Wireless telecommunication systems --- Telecommunication systems --- CMOS (Electronics) --- Complementary metal oxide semiconductors --- Semiconductors, Complementary metal oxide --- Digital electronics --- Logic circuits --- Transistor-transistor logic circuits --- Synthesizers, Frequency --- Frequency changers --- Oscillators, Crystal --- Signal generators --- Academic collection --- Equipment and supplies&delete& --- Electrical engineering. --- Computer-aided engineering. --- Electrical Engineering. --- Computer-Aided Engineering (CAD, CAE) and Design. --- CAE --- Engineering --- Electric engineering --- Data processing --- Design and construction. --- Frequency synthesizers - Design and construction --- Wireless communication systems - Equipment and supplies - Design and construction --- Metal oxide semiconductors, Complementary - Design and construction